Dyna-Purge® E Purging Compound

Designed for Purging High-Temperature Engineering ResinsGeneral Description:DYNA-PURGE E is a high heat-resistant, non-abrasive, non-chemical “engineered” thermoplastic purging compound, formulated to purge high-temperature engineering resins. A non-melting but softening thermoplastic scrubs the screw and barrel of both injection molding machines and extruders, while the carrier matrix flushes away impurities.FEATURES & BENEFITS OF DYNA-PURGE EExcellent for color to clear changes, resin changes, preventative machine maintenance, and before manual cleaningEffective through a wide temperature range 590°F-700°F (310°C-371°C)Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speedNon-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the systemSafe, non-hazardous, with no chemicals – ingredients are FDA compliantHeat stable – recommended during shutdown and start-upLow “cost-per-purge” – only small quantity needed to be effectiveNo mixing required – simply use “as is”Unlimited shelf life