E-Polymers SEPAZ® C245GP 45% Glass Fiber Reinforced LCP Resin

Manufacturer E-Polymers Co. Ltd.
Trade Name SEPAZ®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union

Description

Material Notes:
Liquid Crystal Polymer Resin: SEPAZ LCP resin has a unique structure and performance unthought of in a traditional plastics. Beside SEPAZ LCP takes the excels in all-around performance and molding productivity. SEPAZ LCP has a unique attribute in that the thinner the product becomes, the greater the mechanical strength. SEPAZ LCP finds uses in connectors, sensors and other electronic components and CD pick-up parts, and in copying machine and fax components in office and audio-visual equipment.Information Provided by E-Polymers Co., Ltd.
Physical Properties Metric English Comments
Specific Gravity 1.74 g/cc

1.74 g/cc

ASTM D792
Linear Mold Shrinkage 0.00050 cm/cm

0.00050 in/in

Linear Mold Shrinkage, Transverse 0.0050 cm/cm

0.0050 in/in

 

Mechanical Properties Metric English Comments
Tensile Strength 135.4 MPa

19630 psi

ASTM D638
Elongation at Break 0.90 %

0.90 %

ASTM D638
Flexural Strength 191.3 MPa

27750 psi

ASTM D790
Flexural Modulus 18.34 GPa

2661 ksi

ASTM D790
Izod Impact, Notched 0.588 J/cm

1.10 ft-lb/in

ASTM D256

 

Thermal Properties Metric English Comments
Melting Point 352 °C

666 °F

ASTM D789
Deflection Temperature at 1.8 MPa (264 psi) 295 °C

563 °F

ASTM D648
Flammability, UL94 V-0

V-0

 

Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm

1.00e+15 ohm-cm

ASTM D257
Surface Resistance 1.00e+15 ohm

1.00e+15 ohm

ASTM D257
Dielectric Constant 4.3

@Frequency 1.00e+6 Hz
4.3

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 21.0 kV/mm

@Thickness 1.60 mm
533 kV/in

@Thickness 0.0630 in
ASTM D149
Dissipation Factor 0.025

@Frequency 1.00e+6 Hz
0.025

@Frequency 1.00e+6 Hz
ASTM D150

 

Processing Properties Metric English Comments
Melt Temperature 360 – 370 °C

680 – 698 °F

Mold Temperature 30.0 – 160 °C

86.0 – 320 °F