Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Description
Material Notes:
Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High viscosity paste. Users should not expect the same creamy viscosity as silver-filled epoxies.Design engineers need to be aware of longer lead times and shorter shelf-life than traditional silver-filled epoxies.Suggested applications for hybrid/hermetic packaging: Die-attach and SMD attach instead of silver epoxy; avoiding silver migration inside sealed packages; medical and aerospace electronics and circuits.Passes NASA low outgassing standard ASTM E595 with proper cureInformation Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | <= 50 µm | <= 50 µm | |
| Viscosity | >= 819200 cP
@Temperature 23.0 °C
|
>= 819200 cP
@Temperature 73.4 °F
|
0.5 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 200 °C | 392 °F | Continuous |
| 300 °C | 572 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 388 °C | 730 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00050 ohm-cm | <= 0.00050 ohm-cm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min
@Temperature 150 °C
|
1.00 hour
@Temperature 302 °F
|
Minimum Bond Line |
| Shelf Life | 6.00 Month
@Temperature 25.0 °C
|
6.00 Month
@Temperature 77.0 °F
|
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Brown | |
| Consistency | Smooth thick paste | |
| Number of Components | Single | |
| Weight Loss | 0.06% | 300°C |
