Hexcel® Redux® 609 (0.04 psf) Adhesive film for bonding metallic and composite components
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
Description
Material Notes:
Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 psf and is also available unsupported at 0.06 psf.Features: Flexible cure cycle; Good lap shear performance at temperatures ranging from -67°F to 180°F; Good peel properties from -67°F to 180°F; Good tack to assist in adhesive joint assembly; Less than 1% volatile content; Suitable for bonding a wide range of substrates.Applications: Aluminum to aluminum bonding; Sandwich bonding with a variety of skins and cores
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Storage Temperature | -17.8 °C | 0.000 °F |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength, Yield | 4.48 MPa | 650 psi | Flatwise Tensile |
| Shear Strength | 31.0 MPa
@Temperature 21.1 °C
|
4500 psi
@Temperature 70.0 °F
|
Lap Shear |
| 31.0 MPa
@Temperature 48.9 °C
|
4500 psi
@Temperature 120 °F
|
Lap Shear |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Shelf Life | 12.0 Month
@Temperature -17.8 °C
|
12.0 Month
@Temperature 0.000 °F
|
| Descriptive Properties | Value | Comments |
|---|---|---|
| Areal Weight (psf) | 0.04 | |
| Roll Width (in) | 49 | |
| Standard Roll (ft2) | 1075 | |
| Support | Cotton Scrim |
