Parker Chomerics CHO-FOIL CCE Shielding Tape
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-FOIL |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
Description
Material Notes:
Conductive Adhesive Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive.Typical Applications: Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell; EMI radiation measurement troubleshooting, using CHO-FOIL tape to shield ventilation slots or seam gaps; Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures; Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum; EMI shield for cables by wrapping the tape around the cable. An overlap is recommended; ESD shielding; Provide corrosion-resistant ground contact points; Fabric tape available where weight and flexibility are important, such as for wrapping cables. Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Thickness | 35.6 microns | 1.40 mil | Foil thickness |
| 38.1 microns | 1.50 mil | Adhesive thickness | |
| 102 microns | 4.00 mil | Total; Embossing adds 1.1 mil |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Peel Strength | 0.491 kN/m | 2.80 pli | Initial; ASTM D1000 |
| 0.684 kN/m
@Temperature 85.0 °C,
Time 605000 sec |
3.90 pli
@Temperature 185 °F,
Time 168 hour |
ASTM D1000 | |
| 3.70 kN/m
@Temperature 121 °C,
Time 605000 sec |
21.1 pli
@Temperature 250 °F,
Time 168 hour |
ASTM D1000 | |
| Taber Abrasion, mg/1000 Cycles | <= 5.0 | <= 5.0 | 500 gramweight. CS-10 wheel, 500 cycles; CHO-TP-57 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 205 °C | 401 °F | |
| Minimum Service Temperature, Air | -40.0 °C | -40.0 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Surface Resistance | <= 0.0020 ohm | <= 0.0020 ohm | Initial Surface Resistivity (SR) |
| <= 0.0030 ohm | <= 0.0030 ohm | Initial through resistivity (TR) | |
| <= 0.0030 ohm | <= 0.0030 ohm | Initial Taber Abrasion; CHO-TP-57 | |
| <= 0.0020 ohm
@Temperature 85.0 °C,
Time 605000 sec |
<= 0.0020 ohm
@Temperature 185 °F,
Time 168 hour |
(SR); CHO-TP-57 | |
| <= 0.0030 ohm
@Temperature 85.0 °C,
Time 605000 sec |
<= 0.0030 ohm
@Temperature 185 °F,
Time 168 hour |
(TR); CHO-TP-57 | |
| <= 0.0030 ohm
@Temperature 121 °C,
Time 605000 sec |
<= 0.0030 ohm
@Temperature 250 °F,
Time 168 hour |
(SR); CHO-TP-57 | |
| <= 0.0030 ohm
@Temperature 121 °C,
Time 605000 sec |
<= 0.0030 ohm
@Temperature 250 °F,
Time 168 hour |
(TR); CHO-TP-57 | |
| Surface Resistivity per Square | <= 0.0030 ohm | <= 0.0030 ohm | [ohm/in<sup>2<sup>]; <.0005 ohm/cm<sup>2</sup>; MIL-STD-202C |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Adhesion to Aluminum | >40 oz./inch | ASTM D1000 |
| Adhesive Type | Electrically Conductive, Pressure-Sensitive Acrylic | |
| Flame Resistance (UL Subject 510) | Meets | |
| Foil/Fabric Type | 1 oz. Embossed RA Copper |
