Solvay Specialty Polymers Torlon® 4200 Polyamide-imide (PAI) (Unverified Data**)
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
Description
Material Notes:
Torlon 4200 is an unreinforced, unpigmented grade of polyamide-imide (PAI) resin for extrusion. This grade is designed for applications in the semiconductor industry which cannot tolerate particulates such as metals or inorganic particles migrating from the polymer. Torlon 4200 has the best impact resistance and greatest elongation of all the Torlon grades. Torlon PAI has the highest strength and stiffness of any thermoplastic up to 275°C (525°F). It has outstanding resistance to wear, creep, and chemicals. – High Flow: Torlon 420O EXTInformation provided by Solvay Specialty Polymers.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.42 g/cc | 1.42 g/cc | ASTM D792 |
| Water Absorption | 0.33 %
@Time 86400 sec
|
0.33 %
@Time 24.0 hour
|
ASTM D570 |
| Linear Mold Shrinkage, Flow | 0.0060 – 0.0085 cm/cm | 0.0060 – 0.0085 in/in | ASTM D955 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength | 152 MPa | 22000 psi | Type I; ASTM D638 |
| Tensile Stress | 192 MPa | 27800 psi | ASTM D1708 |
| Elongation at Break | 7.6 % | 7.6 % | Type I; ASTM D638 |
| 15 % | 15 % | ASTM D1708 | |
| Tensile Modulus | 4.48 GPa | 650 ksi | Type I; ASTM D638 |
| 4.90 GPa | 711 ksi | ASTM D1708 | |
| Flexural Strength | 118 MPa
@Temperature 232 °C
|
17100 psi
@Temperature 450 °F
|
ASTM D790 |
| 241 MPa
@Temperature 23.0 °C
|
35000 psi
@Temperature 73.4 °F
|
ASTM D790 | |
| Flexural Modulus | 3.59 GPa
@Temperature 232 °C
|
521 ksi
@Temperature 450 °F
|
ASTM D790 |
| 5.03 GPa
@Temperature 23.0 °C
|
730 ksi
@Temperature 73.4 °F
|
ASTM D790 | |
| Compressive Strength | 221 MPa | 32100 psi | ASTM D695 |
| Compressive Modulus | 4.00 GPa | 580 ksi | ASTM D695 |
| Poissons Ratio | 0.45 | 0.45 | Value linked with measurement setup; ASTM E132 |
| Shear Modulus | 1.54 – 1.69 GPa | 223 – 245 ksi | Calculated |
| Izod Impact, Notched | 1.40 J/cm | 2.62 ft-lb/in | ASTM D256 |
| 11.0 J/cm | 20.6 ft-lb/in | ASTM D4812 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 31.0 µm/m-°C | 17.2 µin/in-°F | TMA; ASTM E831 |
| Thermal Conductivity | 0.260 W/m-K | 1.80 BTU-in/hr-ft²-°F | ASTM C177 |
| Deflection Temperature at 1.8 MPa (264 psi) | 278 °C | 532 °F | Unannealed; ASTM D648 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 2.00e+17 ohm-cm | 2.00e+17 ohm-cm | ASTM D257 |
| Surface Resistance | 5.00e+18 ohm | 5.00e+18 ohm | ASTM D257 |
| Dielectric Constant | 3.9
@Frequency 1.00e+6 Hz
|
3.9
@Frequency 1.00e+6 Hz
|
ASTM D150 |
| 4.2
@Frequency 60.0 Hz
|
4.2
@Frequency 60.0 Hz
|
ASTM D150 | |
| Dielectric Strength | 23.0 kV/mm | 584 kV/in | ASTM D149 |
| Dissipation Factor | 0.026
@Frequency 60.0 Hz
|
0.026
@Frequency 60.0 Hz
|
ASTM D150 |
| 0.031
@Frequency 1.00e+6 Hz
|
0.031
@Frequency 1.00e+6 Hz
|
ASTM D150 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Rear Barrel Temperature | 304 °C | 579 °F | |
| Nozzle Temperature | 371 °C | 700 °F | |
| Mold Temperature | 199 – 216 °C | 390 – 421 °F | |
| Drying Temperature | 177 °C | 351 °F | |
| Dry Time | 3.00 hour | 3.00 hour | |
| Moisture Content | 0.050 % | 0.050 % | |
| Back Pressure | 6.89 MPa | 999 psi | |
| Screw Speed | 50 – 100 rpm | 50 – 100 rpm |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Availability | Africa & Middle East | |
| Asia Pacific | ||
| Europe | ||
| North America | ||
| South America | ||
| Features | Ductile | |
| Flame Retardant | ||
| Good Chemical Resistance | ||
| Good Creep Resistance | ||
| Good Electrical Properties | ||
| Good Wear Resistance | ||
| High Heat Resistance | ||
| High Temperature Strength | ||
| Ultra High Impact Resistance | ||
| Forms | Pellets | |
| Generic | PAI | |
| Processing Method | Injection Molding | |
| Machining | ||
| Profile Extrusion | ||
| Screw L/D Ratio | 18.0:1.0 to 24.0:1.0 | |
| Uses | Electrical/Electronic Applications | |
| Machine/Mechanical Parts | ||
| Semiconductor Molding Compounds |
