Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
Description
Material Notes:
Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400ºC seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.22 g/cc | 1.22 g/cc | |
| Particle Size | <= 10 µm | <= 10 µm | |
| Viscosity | 350000 – 550000 cP
@Temperature 23.0 °C
|
350000 – 550000 cP
@Temperature 73.4 °F
|
0.5 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 80 | 80 | |
| Tensile Modulus | 7.79 GPa | 1130 ksi | Storage |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 46.0 µm/m-°C | 25.6 µin/in-°F | Below Tg |
| 139 µm/m-°C | 77.2 µin/in-°F | Above Tg | |
| Thermal Conductivity | 0.760 W/m-K | 5.27 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 300 °C | 572 °F | Continuous |
| 400 °C | 752 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 200 °C | >= 392 °F | Cure 150ºC/1 hour + 275ºC/1 hours; Ramp 20°C/min to 350ºC |
| Decomposition Temperature | 519 °C | 966 °F | Degradation Temperature |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities – Na (Sodium) | 107 ppm | 107 ppm | |
| Ionic Impurities – K (Potassium) | 2.0 ppm | 2.0 ppm | |
| Ionic Impurities – Cl (Chloride) | 50 ppm | 50 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min
@Temperature 150 °C
|
1.00 hour
@Temperature 302 °F
|
+ 275°C, Minimum, Pre-Bake |
| Shelf Life | 12.0 Month
@Temperature 25.0 °C
|
12.0 Month
@Temperature 77.0 °F
|
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Black | |
| Consistency | Smooth paste | |
| Die Shear | 3.8 kg | |
| Ionic Impurities NH4 | 27 ppm | |
| Number of Components | Single | |
| Thixotropic Index | >1.3 | between 0.5 & 1 rpm |
| Weight Loss | 0.22% | 200°C |
| 0.23% | 250°C | |
| 0.29% | 300°C |
