Ensinger TECASINT 5051 Polyimide, 30% Glass Fiber Filled (PI)

TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excellent wear resistance among other things. The TECASINT 2000 series offers these enhanced thermal properties along with lower moisture absorption, a higher degree of toughness, and better machining properties. TECASINT 2011 is unfilled, while TECASINT 2021 contains 15% graphite which offer improved wear resistance and a lower coefficient of friction. TECASINT 2000 series with their superior physical properties, are ideal for application in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries.Main FeaturesHigh thermal and mechanical capacityHigh gamma radiation resistanceGood chemical resistanceEasily machinedFlame retardant according to UL94 V-0Very creep resistantGood wear propertiesLow coefficient of thermal expansionVery good electrical insulationSensitive to hydrolysis in higher thermal rangeApplicationsMechanical engineeringCryogenicsAircraft and aerospace industriesElectronicsNuclear and vacuum technologyElectrical engineeringPreferred FieldsSwitch parts, connector, housing, lead backerInformation Provided by Ensinger, Inc.