Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound (discontinued **)

Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound  (discontinued **).pdf 
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Description

Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconductor devices including diodes, transistors, and integrated circuits in dual in-line, quad or small outline confiations.
Physical Properties Metric English Comments
Density 1.80 g/cc

0.0650 lb/in³

Spiral Flow 64.0 – 88.0 cm

25.2 – 34.6 in

177°C/1000 psi

 

Mechanical Properties Metric English Comments
Hardness, Shore D 80

80

Tensile Strength, Ultimate 97.0 MPa

14100 psi

Flexural Strength 147 MPa

21300 psi

 

Thermal Properties Metric English Comments
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
12.2 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 78.0 µm/m-°C

@Temperature 20.0 °C
43.3 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.600 W/m-K

4.16 BTU-in/hr-ft²-°F

Glass Transition Temp, Tg 155 °C

311 °F

Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in

 

Electrical Properties Metric English Comments
Dielectric Constant 3.9

@Frequency 1000 Hz
3.9

@Frequency 1000 Hz
Dielectric Strength 20.0 kV/mm

508 kV/in

Dissipation Factor 0.0060

@Frequency 1000 Hz
0.0060

@Frequency 1000 Hz
Arc Resistance 190 sec

190 sec

 

Processing Properties Metric English Comments
Processing Temperature 175 – 185 °C

347 – 365 °F

Molding temperature