Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound (discontinued **)
| Manufacturer | |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound (discontinued **).pdf |
| Price | EMAIL US sales@lookpolymers.com |
Category Epoxy, Molded, Mineral Filled
Description
Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconductor devices including diodes, transistors, and integrated circuits in dual in-line, quad or small outline confiations.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.80 g/cc | 0.0650 lb/in³ | |
| Spiral Flow | 64.0 – 88.0 cm | 25.2 – 34.6 in | 177°C/1000 psi |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 80 | 80 | |
| Tensile Strength, Ultimate | 97.0 MPa | 14100 psi | |
| Flexural Strength | 147 MPa | 21300 psi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 22.0 µm/m-°C
@Temperature 20.0 °C
|
12.2 µin/in-°F
@Temperature 68.0 °F
|
|
| CTE, linear, Transverse to Flow | 78.0 µm/m-°C
@Temperature 20.0 °C
|
43.3 µin/in-°F
@Temperature 68.0 °F
|
|
| Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | |
| Glass Transition Temp, Tg | 155 °C | 311 °F | |
| Flammability, UL94 | V-0
@Thickness 3.20 mm
|
V-0
@Thickness 0.126 in
|
|
| V-0
@Thickness 3.20 mm
|
V-0
@Thickness 0.126 in
|
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.9
@Frequency 1000 Hz
|
3.9
@Frequency 1000 Hz
|
|
| Dielectric Strength | 20.0 kV/mm | 508 kV/in | |
| Dissipation Factor | 0.0060
@Frequency 1000 Hz
|
0.0060
@Frequency 1000 Hz
|
|
| Arc Resistance | 190 sec | 190 sec |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 175 – 185 °C | 347 – 365 °F | Molding temperature |