Dyna-Purge® K Purging Compound

Designed or a broad range of “Low-Temp” resinsGeneral Description:DYNA-PURGE K is a low-temp, non-abrasive, non-chemical “engineered” thermoplastic purging compound, formulated to flow naturally through the barrel and hot runner system of the injection molding machine, as well as extrusion equipment. A non-melting but softening thermoplastic scrubs the screw and barrel, while the carrier matrix flushes away impurities.FEATURES & BENEFITS OF DYNA-PURGE KDeveloped for color changes, resin changes, preventative machine maintenance, and before manual cleaningExcellent for purging through hot runner systems with a minimum clearance of .025 inch (.65 mm)Effective through a wide temperature range 290°F to 550° F (143°C to 287°C)Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speedNon-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the systemSafe, non-hazardous, with no chemicals – ingredients are FDA compliantHeat stable – recommended during shutdown and start-upLow “cost-per-purge” – only small quantity needed to be effectiveNo mixing required – simply use “as is”Unlimited shelf life