LATI LAESTRA G/30 30% Glass Fiber Reinforced Syndiotactic Polystyrene (SPS) (discontinued **)

Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union

Material Notes:
Description: Laestra compounds are syndiotactic polystyrene (SPS) products. SPS is a polymer offering a combination of properties unavailable with other materials. It exhibits a melting point of 270°C and a glass transition temperature of 100°C, therefore it is an alternative to more expensive high temperature materials. Laestra compounds retain excellent property performance levels and dimensional stability at high temperature environments/applications like under the hood components or IR soldering of connectors. Laestra provides a resistance against a wide range of acids, bases and organic solvents. Moreover, it does not absorb moisture and is not affected by water at room or high temperatures. Glass Reinforced Laestra offers high rigidity at high temperatures and lower differential shrinkage compared to other semi-crystalline resins. However the presence of glass fiber still requires an accurate design in order to reduce the risk of warpage.Specific Notes for this Material: SPS, 30% glass fiberDisclaimer from LATI: This document contains information based on average values as obtained from the results of laboratory tests and observations made on LATI materials. Tested materials were injection molded, used in their natural color, and conditioned in compliance with Standard ASTM D 618, procedure A. These values refer to LATI’s best technical and scientific knowledge at the moment of testing and cannot be used as a basis for the development of applications. For a better assessment of the materials, you are kindly requested to contact LATI’s technical or commercial offices, which are at your disposal and will supply detailed information on the most suitable characteristics for their intended use. With reference to DPR n.224 dated May 24, 1988, issued in accordance with EC Guide-lines 85/374, LATI Industria Termoplastici S.p.A. declines all responsibility arising from an improper use of the products described in this document.All data provided by LATI.
Physical Properties Metric English Comments
Density 1.24 g/cc

0.0448 lb/in³

ISO 1183
Linear Mold Shrinkage 0.0040 cm/cm

0.0040 in/in

LATI
Linear Mold Shrinkage, Transverse 0.011 cm/cm

0.011 in/in

LATI
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 110 MPa

16000 psi

ISO 527
Flexural Modulus 9.10 GPa

1320 ksi

ASTM D790
Izod Impact, Notched 0.850 J/cm

@Temperature 23.0 °C
1.59 ft-lb/in

@Temperature 73.4 °F
ASTM D256
Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 240 °C

464 °F

ASTM D648
Flammability, UL94 HB

@Thickness 1.50 mm
HB

@Thickness 0.0591 in
Electrical Properties Metric English Comments
Dielectric Strength 17.0 kV/mm

@Thickness 2.00 mm
432 kV/in

@Thickness 0.0787 in
IEC 243-1
Comparative Tracking Index >= 400 V

>= 400 V

IEC 112
Processing Properties Metric English Comments
Melt Temperature 300 – 325 °C

572 – 617 °F

Mold Temperature 100 – 150 °C

212 – 302 °F

Drying Temperature 80.0 – 100 °C

176 – 212 °F

Not essential. Moisture pickup may occur under adverse, high humidity conditions.
Dry Time >= 2 hour

>= 2 hour

Descriptive Properties Value Comments
Injection Speed high

Description

Material Notes:
Description: Laestra compounds are syndiotactic polystyrene (SPS) products. SPS is a polymer offering a combination of properties unavailable with other materials. It exhibits a melting point of 270°C and a glass transition temperature of 100°C, therefore it is an alternative to more expensive high temperature materials. Laestra compounds retain excellent property performance levels and dimensional stability at high temperature environments/applications like under the hood components or IR soldering of connectors. Laestra provides a resistance against a wide range of acids, bases and organic solvents. Moreover, it does not absorb moisture and is not affected by water at room or high temperatures. Glass Reinforced Laestra offers high rigidity at high temperatures and lower differential shrinkage compared to other semi-crystalline resins. However the presence of glass fiber still requires an accurate design in order to reduce the risk of warpage.Specific Notes for this Material: SPS, 30% glass fiberDisclaimer from LATI: This document contains information based on average values as obtained from the results of laboratory tests and observations made on LATI materials. Tested materials were injection molded, used in their natural color, and conditioned in compliance with Standard ASTM D 618, procedure A. These values refer to LATI’s best technical and scientific knowledge at the moment of testing and cannot be used as a basis for the development of applications. For a better assessment of the materials, you are kindly requested to contact LATI’s technical or commercial offices, which are at your disposal and will supply detailed information on the most suitable characteristics for their intended use. With reference to DPR n.224 dated May 24, 1988, issued in accordance with EC Guide-lines 85/374, LATI Industria Termoplastici S.p.A. declines all responsibility arising from an improper use of the products described in this document.All data provided by LATI.
Physical Properties Metric English Comments
Density 1.24 g/cc

0.0448 lb/in³

ISO 1183
Linear Mold Shrinkage 0.0040 cm/cm

0.0040 in/in

LATI
Linear Mold Shrinkage, Transverse 0.011 cm/cm

0.011 in/in

LATI

 

Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 110 MPa

16000 psi

ISO 527
Flexural Modulus 9.10 GPa

1320 ksi

ASTM D790
Izod Impact, Notched 0.850 J/cm

@Temperature 23.0 °C
1.59 ft-lb/in

@Temperature 73.4 °F
ASTM D256

 

Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 240 °C

464 °F

ASTM D648
Flammability, UL94 HB

@Thickness 1.50 mm
HB

@Thickness 0.0591 in

 

Electrical Properties Metric English Comments
Dielectric Strength 17.0 kV/mm

@Thickness 2.00 mm
432 kV/in

@Thickness 0.0787 in
IEC 243-1
Comparative Tracking Index >= 400 V

>= 400 V

IEC 112

 

Processing Properties Metric English Comments
Melt Temperature 300 – 325 °C

572 – 617 °F

Mold Temperature 100 – 150 °C

212 – 302 °F

Drying Temperature 80.0 – 100 °C

176 – 212 °F

Not essential. Moisture pickup may occur under adverse, high humidity conditions.
Dry Time >= 2 hour

>= 2 hour

 

Descriptive Properties Value Comments
Injection Speed high