Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy

Manufacturer Sumitomo Bakelite North America
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union

Description

Material Notes:
Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Physical Properties Metric English Comments
Density 1.95 g/cc

0.0704 lb/in³

ASTM D792
Water Absorption 0.30 %

0.30 %

48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0020 – 0.0040 cm/cm

0.0020 – 0.0040 in/in

Compression Molding. ASTM D955

 

Mechanical Properties Metric English Comments
Hardness, Barcol 73

73

Tensile Strength, Ultimate 65.0 MPa

9430 psi

ASTM D638
Flexural Yield Strength 117 MPa

17000 psi

ASTM D790
Flexural Modulus 13.8 GPa

2000 ksi

ASTM D790
Compressive Yield Strength 214 MPa

31000 psi

ASTM D695
Izod Impact, Notched 0.320 J/cm

0.599 ft-lb/in

ASTM D256A

 

Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 47.0 Âµm/m-°C

@Temperature 20.0 °C
26.1 Âµin/in-°F

@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.586 W/m-K

4.07 BTU-in/hr-ft²-°F

ASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 Â°C

500 Â°F

ASTM D648A
Oxygen Index 38 %

38 %

ASTM D2863

 

Electrical Properties Metric English Comments
Dielectric Constant 4.0

4.0

Wet; ASTM D150
Dielectric Strength 11.0 kV/mm

279 kV/in

Wet, short term. ASTM D149
Dissipation Factor 0.020

@Frequency 1e+6 Hz
0.020

@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 175 sec

175 sec

ASTM D495

 

Processing Properties Metric English Comments
Mold Temperature 143 – 177 Â°C

289 – 351 Â°F

compression/transfer molding.
174 – 182 Â°C

345 – 360 Â°F

injection molding.