Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy
| Manufacturer | Sumitomo Bakelite North America |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
Description
Material Notes:
Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
| Water Absorption | 0.20 % | 0.20 % | 48 hours, 50°C. ASTM D570 |
| Linear Mold Shrinkage | 0.0030 – 0.0050 cm/cm | 0.0030 – 0.0050 in/in | Compression Molding. ASTM D955 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Barcol | 72 | 72 | |
| Tensile Strength, Ultimate | 62.0 MPa | 8990 psi | ASTM D638 |
| Flexural Yield Strength | 124 MPa | 18000 psi | ASTM D790 |
| Flexural Modulus | 15.2 GPa | 2200 ksi | ASTM D790 |
| Compressive Yield Strength | 207 MPa | 30000 psi | ASTM D695 |
| Izod Impact, Notched | 0.350 J/cm | 0.656 ft-lb/in | ASTM D256A |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 37.0 µm/m-°C
@Temperature 20.0 °C
|
20.6 µin/in-°F
@Temperature 68.0 °F
|
ASTM D696 |
| Thermal Conductivity | 0.691 W/m-K | 4.80 BTU-in/hr-ft²-°F | ASTM F433 |
| Deflection Temperature at 1.8 MPa (264 psi) | 260 °C | 500 °F | ASTM D648A |
| Oxygen Index | 50 % | 50 % | ASTM D2863 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 4.0 | 4.0 | Wet; ASTM D150 |
| Dielectric Strength | 12.0 kV/mm | 305 kV/in | Wet, short term. ASTM D149 |
| Dissipation Factor | 0.019
@Frequency 1e+6 Hz
|
0.019
@Frequency 1e+6 Hz
|
Wet; ASTM D150 |
| Arc Resistance | 180 sec | 180 sec | ASTM D495 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 143 – 177 °C | 289 – 351 °F | compression/transfer molding. |
| 174 – 182 °C | 345 – 360 °F | injection molding. |
