UBE UPILEX VT Polyimide Film
| Manufacturer | UBE |
| Trade Name | UPILEX |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
Description
Material Notes:
Description: UPILEX, the ultra-high heat-resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which process Ube Industries originally developed, and diamine. Most notable of these characteristics is UPILEX’s physical, mechanical, electrical, and chemical properties under high-temperature conditions.UPILEX VT is a heat bonding type of polyimide film without using adhesive and applicable with various substrate material.Features: Heat bonding ability with ceramics, silicon wafers, and metalsBonding temperature : 300°CExcellent characteristics as polyimide filmApplications: FPCHDD SuspensionCeramics LaminationMetal substrate PCBSheet heaterMicro MachineInformation provided by UBE.
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Film Elongation at Break, MD | 54 % | 54 % | 25°C; ASTM D882 |
| 74 % | 74 % | 300°C; ASTM D882 | |
| Secant Modulus, MD | 1.765 GPa | 256.0 ksi | 300°C; ASTM D882 |
| 6.67 GPa | 967 ksi | 25°C; ASTM D882 | |
| Film Tensile Strength at Break, MD | 98.1 MPa | 14200 psi | 300°C; ASTM D882 |
| 313.8 MPa | 45510 psi | 25°C; ASTM D882 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 18.0 µm/m-°C
@Temperature 20.0 – 200 °C
|
10.0 µin/in-°F
@Temperature 68.0 – 392 °F
|
ASTM D233 |
| Shrinkage | 0.100 %
@Temperature 200 °C,
Time 7200 sec |
0.100 %
@Temperature 392 °F,
Time 2.00 hour |
JIS C2318 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+17 ohm-cm
@Temperature 25.0 °C
|
1.00e+17 ohm-cm
@Temperature 77.0 °F
|
ASTM D257 |
| Dielectric Constant | 3.2
@Frequency 1000 Hz
|
3.2
@Frequency 1000 Hz
|
ASTM D150 |
| Dielectric Strength | 200 kV/mm | 5080 kV/in | 25 µm; ASTM D149 |
